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| sot389-1_fp_re?ow ? koninklijke philips electronics n.v. 2004. all rights reserved. pdf 29 december 2004 1 of 1 philips semiconductors pc board footprint sot389-1 dimensions in mm occupied area footprint information for reflow soldering of LQFP44 package ax bx gx gy hy hx ay by p1 p2 d2 (8 ) d1 (0.125) ax ay bx by d1 d2 gx gy hx hy 13.300 13.300 10.300 10.300 p1 0.800 p2 0.850 0.500 c 1.500 0.600 10.500 10.500 13.550 13.550 solder land c generic footprint pattern refer to the package outline drawing for actual layout free datasheet http://
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